Sobre WINTIME

WINTIME Semiconductor was established in 2020, integrating the research, development, production, and sales of high-precisionfer-level cutting blades. It provides customers with solutions for the entire process of high-precision cutting, helping to improve cutting quality and reduce production costs. It is recognized many leading enterprises at home and abroad as a supplier of high-precision cutting blades, cutting tapes, and cutting solutions. In 2023, nantong wintime Semiconductor Special Materials Project had a total investment of nearly tens of millions of yuan, with a new factory and auxiliary buildings of 34,00 square meters, and an annual production capacity of more than 1 million pieces of dicing blades, ranking in the forefront of the country. It has 2 patent technologies and has won many awards in national, provincial, and municipal science and technology competitions and entrepreneurship competitions. The company's completed "Ultra-thin Wafer D Blade" project has achieved a thickness of less than 9 microns in the process, and the product quality has reached the international cutting-edge level. It is of the few domestic companies that can achieve mass production. As a domestic self-developed project, we carry out the domestic substitution of high-end industries on the basis of advanced technology.
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Equipe de classe mundial
Formados em universidades de topo mundiais
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P&D avançado
Desenvolvido internamente
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Foco em inovação
Múltiplas tecnologias inovadoras

Nossos produtos

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Sawing Blade

Sawing Blade

Modelo: SB-001
Parâmetros: 0932490867

Dicing Blade

Dicing Blade

Modelo: DB-001
Parâmetros: 1353562808

Lâmina de corte de wafer ultrafino da série DZY ≤9μm para corte de semicondutores

Lâmina de corte de wafer ultrafino da série DZY ≤9μm para corte de semicondutores

Modelo: DB-001
Parâmetros: 4058107413

Lâmina de corte de ligação de metal da série JS para Dicing Semicondutor de Precisão

Lâmina de corte de ligação de metal da série JS para Dicing Semicondutor de Precisão

Modelo: DB-001
Parâmetros: 9556171290

Lâmina de corte de ligação de resina da série SZ para corte de wafer de baixa tensão

Lâmina de corte de ligação de resina da série SZ para corte de wafer de baixa tensão

Modelo: DB-001
Parâmetros: 9806757319

Galeria da empresa

WINTIME Workshop
WINTIME Workshop
WINTIME Workshop
WINTIME Workshop
WINTIME Workshop
WINTIME Workshop
WINTIME Workshop
WINTIME Workshop
WINTIME Office Area
WINTIME Office Area
WINTIME Office Area
WINTIME Office Area
WINTIME Workshop
WINTIME Workshop
WINTIME Workshop
WINTIME Workshop
WINTIME Office Area
WINTIME Office Area
WINTIME Office Area
WINTIME Office Area
WINTIME Building
WINTIME Building

Histórias de sucesso

Semiconductor Packaging Factory

Semiconductor Packaging Factory

Cutting chipping rate ≤5μm, wafer yield increased by 12%, stable mass production without blade replacement
Ultra-thin thickness ≤9μm, narrow kerf, low material loss, long service life

Localização: CN 📦 Quantity: 500,000+ pieces annual usage, mass production line matching

Vídeos da empresa e produtos

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Introdução da empresa e tour pela fábrica

⏱ Duration: 3:45 | 👁 Views: 15,230

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Demonstração do produto - Kestrel K-1

⏱ Duration: 5:12 | 👁 Views: 28,450

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Showcase de inovação tecnológica

⏱ Duration: 4:30 | 👁 Views: 12,890

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Depoimentos de clientes e histórias de sucesso

⏱ Duration: 6:20 | 👁 Views: 9,650

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