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DZR-S Series Slotted Diamond Slicing Blade for High-Speed Dicing

Inventário:
SKU: 6761401208
Modelo: SB-001

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DZR-S Series Slotted Diamond Slicing Blade | WINTIME Semiconductor

DZR-S Series Slotted Diamond Slicing Blade

Product Summary

The DZR-S Series features a slotted design that enhances cooling and chip removal during high-speed dicing. With thickness options from 8μm to 50μm and cutting accuracy of ±0.002mm, this blade is optimized for slicing semiconductor wafers and ceramics where debris management is critical.

Key Selling Points

  • Slotted Design: Radial slots improve coolant flow and reduce thermal damage.
  • Superior Chip Evacuation: Minimizes re-cutting and blade loading.
  • High Cutting Accuracy: ±0.002mm ensures consistent die dimensions.
  • Wide Speed Range: Suitable for 30000-60000 rpm operation.

Technical Specifications

ParameterValue
Thickness Range8μm - 50μm
Cutting Accuracy±0.002mm
Spindle Speed30000 - 60000 rpm
HardnessHRC 65-70
Bond TypeResin / Metal
Chip Removal Rate≥1.2 mm³/s
AbrasiveDiamond Superabrasive
Base MaterialHigh-Strength Steel

Models and Options

Available in diameters 58-102mm with various slot counts and geometries. Custom slot patterns can be designed for specific applications.

Materials and Structure

The DZR-S blade uses a high-strength steel core with electroplated or sintered diamond rim. Slots are strategically positioned to balance strength and cooling.

Applications

  • Semiconductor wafer slicing (ingot to wafer)
  • Optical glass cutting
  • Ceramic substrate dicing
  • Multi-layer ceramic capacitor (MLCC) separation

Customization

Custom slot design, thickness, and bond type available. MOQ for standard: 100 pcs; customized: 500 pcs. Trial orders accepted.

FAQ

1. How do the slots affect blade strength?

Slots are designed to maintain structural integrity while enhancing cooling. Finite element analysis ensures no reduction in performance.

2. Can DZR-S blades be re-dressed?

Yes, dressing is possible using standard aluminum oxide dressing sticks.

3. What are the recommended cutting parameters for sapphire?

For sapphire, use lower feed rates (0.5-1 mm/s) and higher spindle speed (50000 rpm) with resin bond.

4. Do you provide test samples?

Sample orders are available for evaluation before volume purchase.

5. What is the packaging for export?

Blades are packed in individual plastic cases, then in foam-lined cartons.

Inquiry Information

Contact us for quote and lead time:
Email: shenxiangfei@ntwintime.com
Tel: +86 13851530812
Whatsapp: +8618888053207