DZY Series Ultra-Thin Wafer Dicing Blade
Product Summary
The DZY series dicing blade is engineered for ultra-precision wafer cutting, achieving an ultra-thin thickness of ≤9 μm. It delivers high cutting efficiency and stable mass production performance, making it ideal for semiconductor packaging applications. With an annual production capacity of over 1 million pieces, WINTIME ensures reliable supply for high-volume production lines.
Key Selling Points
- Ultra-Thin Thickness ≤9 μm: Enables narrow kerf cutting with minimal material loss, reducing waste and improving yield.
- Cutting Chipping Rate ≤5 μm: Proven in case study with semiconductor packaging factory, wafer yield increased by 12%.
- High Precision for Wafer Cutting: Specifically designed for 8–12 inch semiconductor wafers, ensuring dimensional accuracy.
- Stable Mass Production: Consistent performance over long production runs with low blade wear, reducing downtime.
- Annual Capacity Over 1M Pieces: Reliable supply chain for large-scale manufacturing needs.
Technical Specifications
| Parameter | Value |
|---|
| Thickness | ≤9 μm |
| Material Bond | Metal bond (for Metal Dicing Blade) |
| Abrasive Grain | Diamond |
| Wafer Size | 8–12 inch |
| Annual Production Capacity | Over 1 million pieces |
Models and Options
The DZY series includes standard and customized models. Standard models: MOQ 100 pieces. Customized models: MOQ 500 pieces. Small-batch trial orders available with flexible MOQ adjustment.
Materials and Structure
Manufactured with a metal bond (suitable for Metal Dicing Blade) and diamond abrasive grains as the core functional material. The structure is designed for ultra-thin, high-precision cutting with excellent wear resistance.
Applications
- Semiconductor wafer dicing (8–12 inch)
- Semiconductor packaging
- Optical communications device cutting
- New functional materials slicing
- Functional ceramics and alloy materials cutting
Customization
WINTIME offers customization services including bond type, blade dimensions, and specific kerf requirements. For customized models, MOQ is 500 pieces. Contact our sales team for detailed specifications.
Case Study
A leading semiconductor packaging factory in China used the DZY series blade for high-precision dicing of 8–12 inch wafers over 3 years. Results: cutting chipping rate ≤5 μm, wafer yield increased by 12%, stable mass production without blade replacement. Annual usage: 500,000+ pieces.
FAQ
Q1: What is the minimum order quantity for the DZY series?
A: Standard models MOQ is 100 pieces. Customized models MOQ is 500 pieces. Flexible for trial orders.
Q2: Can the DZY blade be used for dry cutting?
A: Yes, both dry and wet cutting modes are supported depending on the dicing machine configuration.
Q3: What is the typical blade life for DZY series?
A: In the case study, the blade performed over long production runs without replacement, indicating a long service life. Exact life depends on wafer material and cutting parameters.
Q4: Are the blades tested before shipment?
A: Yes, pre-shipment testing and optional third-party inspection (SGS) are available.
Q5: Can you provide samples for testing?
A: Small-batch trial orders are accepted with adjustable MOQ. Contact us for details.
Q6: What payment terms are accepted?
A: Standard payment is 30% deposit, 70% before shipment (30/70).
Q7: What is the delivery method?
A: FOB or CIF terms available.
Q8: Does WINTIME have patent protection for this blade?
A: Yes, WINTIME holds 2 patent technologies for dicing blade manufacturing.
Inquiry Information
For pricing, lead time, and technical support, please contact:
Email: shenxiangfei@ntwintime.com
Tel: +86 13851530812
WhatsApp: +8618888053207
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